the TIFFCOM is accepting projects (fictional features) for the Tokyo Gap-Financing Market (TGFM) until August 4, 2023.
About the TGFM:
Tokyo Gap-Financing Market serves as a dedicated platform for selected projects, offering vital support to Japanese, Asian, and international producers in securing financing for their projects. Through personalized one-to-one meetings, these producers have the opportunity to engage with a diverse range of influential international professionals, including producers, sales agents, distributors, financiers, broadcasters, and funders. Notably, all of the professionals invited to participate in TGFM hold decision-making authority, ensuring meaningful connections and potential collaborations.
Eligibility:
– Projects should be in the development phase, and projects that have already been completed will not be accepted.
– Projects must prominently feature Asian elements.*
– Projects should be fictional features, either in live-action or animation format, with a minimum running time of 70 minutes.
– They should be intended for theatrical and/or streaming distribution.
– TV series and documentary projects are not eligible.
– Both original concepts and adaptations are welcome, with no limitations on budget or genre.
– The project must be looking for a maximum of 40% gap-financing.
– Each project must have secured a minimum of 60% of its budget and provide evidence of confirmed financing. The film may be in the development phase, partially or entirely shot.
– Submission Fee: FREE
– Deadline: August 4, 2023
How to submit:
– Fill the Online Entry Form: https://forms.gle/G7iyyNgHKzi8yMT9A
– Email the required materials, listed below, to tgfm(at)unijapan.org to complete your submission. Please ensure that all documents are in English or have an English translation.
We recommend filmmakers to read the full Rules and Regulations here: https://tgfm.tiffcom.jp/en
We remind readers that the TIFFCOM will take place from October 25 – 27, 2023 during the Tokyo International Film Festival in Tokyo, Japan.
